Invention Grant
- Patent Title: Conductive adhesive, anisotropic conductive film, and electronic device using same
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Application No.: US14781746Application Date: 2014-03-27
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Publication No.: US09701874B2Publication Date: 2017-07-11
- Inventor: Hiroshi Uchida , Yoshitaka Ishibashi
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2013-077137 20130402
- International Application: PCT/JP2014/059021 WO 20140327
- International Announcement: WO2014/162990 WO 20141009
- Main IPC: C09J9/02
- IPC: C09J9/02 ; C09J133/14 ; C09J163/10 ; H01B1/22 ; C09D133/06 ; C09J7/00 ; C08K3/08 ; C08K7/18

Abstract:
[Problem] To provide: a conductive adhesive which contains an epoxy (meth)acrylate resin and which can form a bonded zone that is not susceptible to being deteriorated by halogen; an anisotropic conductive film; and electronic devices using both. [Solution] A conductive adhesive and an anisotropic conductive film which each contain a conductive filler and a binder resin, wherein: the binder resin comprises an epoxy (meth)acrylate resin that is a product of addition reaction of (meth)acrylic acid and an epoxy compound having a sum of total chlorine atom concentration and total bromine atom concentration of 300 mass ppm or less, preferably 50 mass ppm or less; and the conductive filler is dispersed in the binder resin which comprises such an epoxy (meth)acrylate resin. The epoxy (meth)acrylate resin is preferably prepared by subjecting a starting compound (substrate) having a carbon-carbon double bond to epoxidation of the double bond with an oxidizing agent consisting of hydrogen peroxide, and then subjecting the obtained epoxy compound to addition reaction with (meth)acrylic acid.
Public/Granted literature
- US20160060490A1 CONDUCTIVE ADHESIVE, ANISOTROPIC CONDUCTIVE FILM AND ELECTRONIC DEVICES USING BOTH Public/Granted day:2016-03-03
Information query
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