Invention Grant
- Patent Title: Electroless copper plating compositions
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Application No.: US14993791Application Date: 2016-01-12
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Publication No.: US09702046B2Publication Date: 2017-07-11
- Inventor: David S. Laitar , Crystal P. L. Li , Andy Lok-Fung Chow
- Applicant: Rohm and Haas Electronic Materials LLC , Dow Global Technologies LLC
- Applicant Address: US MI Midland US MA Marlborough
- Assignee: Dow Global Technologies LLC,Rohm and Haas Electronic Materials LLC
- Current Assignee: Dow Global Technologies LLC,Rohm and Haas Electronic Materials LLC
- Current Assignee Address: US MI Midland US MA Marlborough
- Agent John J. Piskorski
- Main IPC: C23C18/54
- IPC: C23C18/54 ; C23C18/16 ; H05K3/00 ; C23C18/40 ; H05K3/18 ; H05K3/42
Abstract:
Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.
Public/Granted literature
- US20160122876A1 ELECTROLESS COPPER PLATING COMPOSITIONS Public/Granted day:2016-05-05
Information query
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