Invention Grant
- Patent Title: Heat dissipation device
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Application No.: US14509661Application Date: 2014-10-08
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Publication No.: US09702357B2Publication Date: 2017-07-11
- Inventor: Chang-Lin Tsai
- Applicant: Hsien-Chin Su
- Applicant Address: TW Tainan
- Assignee: Hsien-Chin Su
- Current Assignee: Hsien-Chin Su
- Current Assignee Address: TW Tainan
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: TW102144014A 20131202
- Main IPC: F04B45/04
- IPC: F04B45/04 ; F04B45/047 ; H05K7/20 ; G06F1/20

Abstract:
A heat dissipation device includes an air current producing unit and an electromagnet unit separately disposed on a substrate. The air current producing unit includes a resilient fan body mounted to the substrate and having an unrestrained end, and a magnetic component disposed on the fan body. The electromagnet unit is configured to generate a varying magnetic field that acts on the magnetic component so as to cause the fan body to sway, thereby producing air current.
Public/Granted literature
- US20150152859A1 Heat Dissipation Device Public/Granted day:2015-06-04
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