Invention Grant
- Patent Title: Sensor module and method for producing sensor module
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Application No.: US14993745Application Date: 2016-01-12
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Publication No.: US09702777B2Publication Date: 2017-07-11
- Inventor: Kaori Miyashita , Eiji Takeda , Yuuji Nagai , Shinya Matsumura
- Applicant: NAGANO KEIKI CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: NAGANO KEIKI CO., LTD.
- Current Assignee: NAGANO KEIKI CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2015-005021 20150114
- Main IPC: G01L9/00
- IPC: G01L9/00

Abstract:
A detector is provided by coating a fluid conductive material on a flat portion of a diaphragm. The detector includes: a resistor element; resistor element electrodes, which are overlapped and connected with mutually opposed parts of the resistor element; and a linear conductor connected with the resistor element electrodes. The resistor element electrodes each include: a linear portion having a linear inner side facing an inner side of paired one of the resistor element electrodes; and peripheral portions defined at both ends of the linear portion, at least one of the peripheral portions being connected with the linear conductor. All of the linear portions are arranged so that inner sides are arranged mutually in parallel. The resistor element is connected with the linear portion. The peripheral portions are exposed without being connected with the resistor element.
Public/Granted literature
- US20160202136A1 SENSOR MODULE AND METHOD FOR PRODUCING SENSOR MODULE Public/Granted day:2016-07-14
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