- Patent Title: Mounting board, sensor unit, electronic apparatus, and moving body
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Application No.: US14176444Application Date: 2014-02-10
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Publication No.: US09702890B2Publication Date: 2017-07-11
- Inventor: Yoshikuni Saito
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2013-047722 20130311
- Main IPC: H05K7/00
- IPC: H05K7/00 ; G01P1/02 ; G01P1/00 ; H05K1/02 ; H05K7/10 ; H05K1/16 ; H05K1/11

Abstract:
A board main body of a board has a sensor mounting area, in which a physical quantity sensor is mounted, disposed on a surface. A non-electrode forming part and a plurality of electrodes are disposed in the sensor mounting area, the electrodes being disposed so as to be isolated from each other, and to correspond to mounting terminals of the physical quantity sensor. A shield electrode is disposed outside the sensor mounting area.
Public/Granted literature
- US20140254118A1 MOUNTING BOARD, SENSOR UNIT, ELECTRONIC APPARATUS, AND MOVING BODY Public/Granted day:2014-09-11
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