A component mounting apparatus that compresses a component to a transparent substrate on which the component is placed with a photocurable resin interposed therebetween. The component mounting apparatus includes: a receiving unit that includes a base member and a transparent member provided on an upper surface of the base member and receives a surface of the substrate, which is positioned below the component, on an upper surface of the transparent member; a pressing unit that presses the component against the substrate received by the receiving unit; and a light irradiation unit that irradiates the photocurable resin with light through the transparent member.