Invention Grant
- Patent Title: Radiation-sensitive resin composition, resist pattern-forming method, polymer, and method for producing compound
-
Application No.: US14805703Application Date: 2015-07-22
-
Publication No.: US09703195B2Publication Date: 2017-07-11
- Inventor: Hayato Namai , Kota Nishino
- Applicant: JSR CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JSR CORPORATION
- Current Assignee: JSR CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-061138 20130322
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/32 ; G03F7/20 ; C08F12/32 ; C08F12/22 ; C08F220/18 ; C08F212/14 ; C07D307/93 ; C07D307/33 ; C07D327/04 ; C07D493/18 ; C08F220/28

Abstract:
A radiation-sensitive resin composition contains: a polymer having a structural unit that includes a group represented by formula (1); a radiation-sensitive acid generator; and an organic solvent. In the formula (1), RP represents a hydrogen atom or a monovalent organic group, and * denotes a binding site to a rest of the structural unit other than the group represented by the formula (1). It is preferred that RP in the formula (1) represents a monovalent organic group, and the monovalent organic group is an acid-nonlabile group. It is also preferred that RP in the formula (1) represents a monovalent organic group, and the monovalent organic group is an acid-labile group.
Public/Granted literature
Information query
IPC分类: