Invention Grant
- Patent Title: Wiring board and electronic device
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Application No.: US14902353Application Date: 2014-10-23
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Publication No.: US09704791B2Publication Date: 2017-07-11
- Inventor: Kensaku Murakami
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto-Shi, Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto-Shi, Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2013-220260 20131023
- International Application: PCT/JP2014/078226 WO 20141023
- International Announcement: WO2015/060387 WO 20150430
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/498 ; H05K3/40 ; H01L23/00 ; H01L33/62 ; H05K3/46
Abstract:
This wiring board is provided with: an insulating base that has a lateral surface having an incision part; an electrode that is provided on the inner surface of the incision part; and a wiring conductor that is provided within the insulating base or on the surface of the insulating base and is electrically connected to the electrode via a connection conductor. The width of the incision part is larger than the depth thereof, and the connection conductor is connected to the electrode at an end of the incision part in the width direction. An electronic device according to the present invention is provided with this wiring board and an electronic component that is mounted to the upper surface of this wiring board.
Public/Granted literature
- US09666515B2 Wiring board and electronic device Public/Granted day:2017-05-30
Information query
IPC分类:
