Invention Grant
- Patent Title: Semiconductor module
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Application No.: US14786295Application Date: 2014-10-16
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Publication No.: US09704828B2Publication Date: 2017-07-11
- Inventor: Kosuke Ikeda , Yuji Morinaga , Osamu Matsuzaki
- Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Nixon & Vanderhye P.C.
- International Application: PCT/JP2014/077545 WO 20141016
- International Announcement: WO2016/059702 WO 20160421
- Main IPC: H01L23/36
- IPC: H01L23/36 ; H01L23/367 ; H01L23/495 ; H01L25/065 ; H01L23/00 ; H01L23/373 ; H01L23/492 ; H01L23/498 ; H01L25/07

Abstract:
A semiconductor module according to one embodiment of the present invention includes: a first circuit board having thermal conductivity; a second circuit board having thermal conductivity and disposed opposing the first circuit board; a first semiconductor element joined to an opposing surface of the first circuit board opposing the second circuit board; a second semiconductor element joined to an opposing surface of the second circuit board opposing the first circuit board; and a connector electrically connecting the first semiconductor element and the second semiconductor element. The connector includes a portion which is sandwiched between the first semiconductor element and the second circuit board without through the second semiconductor element, and which is in contact with the first semiconductor element and the second circuit board.
Public/Granted literature
- US20160254250A1 SEMICONDUCTOR MODULE Public/Granted day:2016-09-01
Information query
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