Invention Grant
- Patent Title: Super-junction semiconductor device comprising junction termination extension structure and method of manufacturing
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Application No.: US15139664Application Date: 2016-04-27
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Publication No.: US09704984B2Publication Date: 2017-07-11
- Inventor: Franz Hirler , Daniel Tutuc , Andreas Voerckel , Hans Weber
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102015106693 20150429
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/417 ; H01L29/167 ; H01L21/266 ; H01L29/06 ; H01L29/66

Abstract:
A super-junction semiconductor device includes a junction termination area at a first surface of a semiconductor body and at least partly surrounding an active cell area. An inner part of the junction termination area is arranged between an outer part of the junction termination area and the active cell area. A charge compensation device structure includes first regions of a first conductivity type and second regions of a second conductivity type disposed alternately along a first lateral direction. First surface areas correspond to a projection of the first regions onto the first surface, and second surface areas correspond to a projection of the second regions onto the first surface. The super-junction semiconductor device further includes at least one of a first junction termination extension structure and a second junction termination extension structure.
Public/Granted literature
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