- Patent Title: Method for stretching vapor deposition mask, method for producing frame-equipped vapor deposition mask, method for producing organic semiconductor element, and stretching apparatus
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Application No.: US15126651Application Date: 2015-03-30
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Publication No.: US09705083B2Publication Date: 2017-07-11
- Inventor: Katsunari Obata , Hideyuki Okamoto , Yoshiyuki Honma , Toshihiko Takeda
- Applicant: Dai Nippon Printing Co., Ltd.
- Applicant Address: JP Shinjuku-Ku
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Shinjuku-Ku
- Agency: Burr & Brown, PLLC
- Priority: JP2014-074863 20140331; JP2015-067153 20150327
- International Application: PCT/JP2015/059875 WO 20150330
- International Announcement: WO2015/152136 WO 20151008
- Main IPC: H01L51/00
- IPC: H01L51/00 ; B05D1/32 ; H01L51/56 ; B05B15/04 ; H01L51/50

Abstract:
In a method for stretching a vapor deposition mask including a metal mask in which a slit is formed and a resin mask in which an opening corresponding to a pattern to be produced by vapor deposition is formed at a position overlapping with the slit, a stretching assistance member is overlapped on one surface of the vapor deposition mask, the stretching assistance member is fixed to the vapor deposition mask in at least part of a portion in which the one surface of the vapor deposition mask and the stretching assistance member overlap with each other, and the vapor deposition mask fixed to the stretching assistance member is stretched by pulling the stretching assistance member fixed to the vapor deposition mask.
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