Invention Grant
- Patent Title: Method of resin-sealing laminated core
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Application No.: US14049770Application Date: 2013-10-09
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Publication No.: US09705369B2Publication Date: 2017-07-11
- Inventor: Hisatomo Ishimatsu
- Applicant: Mitsui High-tec, Inc.
- Applicant Address: JP Kitakyushu-shi
- Assignee: MITSUI HIGH-TEC, INC.
- Current Assignee: MITSUI HIGH-TEC, INC.
- Current Assignee Address: JP Kitakyushu-shi
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2012-227126 20121012
- Main IPC: B29C45/14
- IPC: B29C45/14 ; H02K1/28 ; H02K1/27 ; H02K15/03 ; B29L31/34 ; B29L31/00

Abstract:
A method of resin-sealing a laminated core, including inserting permanent magnets 24 into magnet insertion holes 18 of a core body 15, pressing the body 15 with upper and lower dies 11, 12, and injecting resin 29 to the holes 18 from a resin reservoir 17 of the die 11 or 12 via a runner 19 in a removable cull plate 14, one end of the runner 19 having plural resin injection holes 33, 34 per hole 18. The resin 29 presses the magnets 24 in the holes 18 to one sides in a radial direction of the holes 18. Thereby, resin-sealing is performed using the plate 14 and the magnets 24 are arranged in radially outward or inward sides even with narrow gaps between the magnets 24 and the holes 18 or without resin injection holes in centers in a width direction of the holes 18.
Public/Granted literature
- US20140103574A1 METHOD OF RESIN-SEALING LAMINATED CORE Public/Granted day:2014-04-17
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