Invention Grant
- Patent Title: Electronic component mounting system and electronic component mounting method
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Application No.: US14297755Application Date: 2014-06-06
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Publication No.: US09706664B2Publication Date: 2017-07-11
- Inventor: Kenji Okamoto , Masahiro Kihara , Katsuhiko Itoh
- Applicant: Panasonic Corporation
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon, LLP
- Priority: JP2013-132235 20130625
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K3/12 ; H05K13/04 ; H05K3/34

Abstract:
An electronic component mounting system includes a screen printing device, an inspection device, an electronic component mounting device, a feedback part that generates, based on inspection data formed by the inspection device, first information about corrections on control parameters pertinent to positioning of a mask to a substrate in the screen printing device, and a feedforward part that generates, based on the inspection data, second information about corrections on electronic component mount coordinates in the electronic component mounting device. The feedback part generates the first information based on the first print displacement value. The feedforward part generates the second information based on the second print displacement value.
Public/Granted literature
- US20140373346A1 ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD Public/Granted day:2014-12-25
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