Provided is a method for manufacturing a rigid-flexible circuit board having a flying-tail structure, comprising the following steps: step 1: manufacturing core substrates needed by daughter boards (500), the cord boards needed by each daughter board comprising at least one flexible core substrate (510) and at least one rigid core substrate (520), stacking and laminating the core substrates to manufacture daughter boards, the number of the manufactured daughter boards being equal to the number of second rigid areas (300), and each daughter board comprising a partial first rigid area (110), a flexible area (200), and a second rigid area (300); step 2, stacking the daughter boards obtained in step 1, and pasting polyetherimide covering films (400) on solder-resist areas of adjacent end surfaces of the second rigid areas; and step 3, providing PTFE gaskets (600) between adjacent flexible areas and adjacent second rigid areas, laminating the daughter boards that have been processed in step 2, and laminating the partial first rigid areas of the daughter plates together to form a first rigid area (100). Also provided is a rigid-flexible circuit board having a flying-tail structure. The method for manufacturing a rigid-flexible circuit board having a flying-tail structure can effectively prevent the solder-resist layer from being damaged.