Invention Grant
- Patent Title: Printhead die
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Application No.: US14771008Application Date: 2013-06-17
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Publication No.: US09707753B2Publication Date: 2017-07-18
- Inventor: Chien-Hua Chen , Michael W. Cumbie , Silam J. Choy
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc.—Patent Department
- Priority: WOPCT/US2013/028207 20130228; WOPCT/US2013/033046 20130320
- International Application: PCT/US2013/046065 WO 20130617
- International Announcement: WO2014/133575 WO 20140904
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
In one example, a printhead die includes a structure having a thickness 100 μm or less and a ratio of length to width of at least 50 and containing, within its thickness, multiple fluid ejectors and multiple fluid chambers each near an ejector and each having an inlet through which printing fluid may enter the chamber and an outlet through which printing fluid may be ejected from the chamber.
Public/Granted literature
- US20160009082A1 PRINTHEAD DIE Public/Granted day:2016-01-14
Information query
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