Invention Grant
- Patent Title: Fluid ejection device with particle tolerant layer extension
-
Application No.: US14650833Application Date: 2012-12-20
-
Publication No.: US09707754B2Publication Date: 2017-07-18
- Inventor: Rio Rivas
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc.—Patent Department
- International Application: PCT/US2012/070794 WO 20121220
- International Announcement: WO2014/098855 WO 20140626
- Main IPC: B41J2/165
- IPC: B41J2/165 ; B41J2/05 ; B41J2/14 ; B41J2/16

Abstract:
In an embodiment, a fluid ejection device includes a thin-film layer formed over a substrate. A primer layer is formed over the thin-film layer, and a chamber layer is formed over the primer layer that defines a fluidic channel leading to a firing chamber. The fluid ejection device includes a slot that extends through the substrate and into the chamber layer through an ink feed hole in the thin-film layer. The fluid ejection device also includes a particle tolerant extension of the primer layer that protrudes into the slot. In some implementations, the particle tolerant primer layer extension extends across a full width of the slot.
Public/Granted literature
- US20150314601A1 FLUID EJECTION DEVICE WITH PARTICLE TOLERANT LAYER EXTENSION Public/Granted day:2015-11-05
Information query
IPC分类: