Invention Grant
- Patent Title: Micromachined ultra-miniature piezoresistive pressure sensor and method of fabrication of the same
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Application No.: US14882408Application Date: 2015-10-13
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Publication No.: US09708175B2Publication Date: 2017-07-18
- Inventor: Bin Qi
- Applicant: Bin Qi
- Agency: JAS Law, LLP
- Agent Ya-Fen Chen
- Main IPC: B81B3/00
- IPC: B81B3/00 ; G01L9/00 ; H01L49/02 ; H01L21/764
Abstract:
A method of fabrication of one or more ultra-miniature piezoresistive pressure sensors on silicon wafers is provided. The diaphragm of the piezoresistive pressure sensors is formed by fusion bonding. The piezoresistive pressure sensors can be formed by silicon deposition, photolithography and etching processes.
Public/Granted literature
- US20160039661A1 MICROMACHINED ULTRA-MINIATURE PIEZORESISTIVE PRESSURE SENSOR AND METHOD OF FABRICATION OF THE SAME Public/Granted day:2016-02-11
Information query
