Invention Grant
- Patent Title: MEMS device with polymer layer, system of a MEMS device with a polymer layer, method of making a MEMS device with a polymer layer
-
Application No.: US14684700Application Date: 2015-04-13
-
Publication No.: US09708180B2Publication Date: 2017-07-18
- Inventor: Alfons Dehe
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B81C1/00 ; B81B3/00

Abstract:
A MEMS device, a method of making a MEMS device and a system of a MEMS device are shown. In one embodiment, a MEMS device includes a first polymer layer, a MEMS substrate disposed on the first polymer layer and a MEMS structure supported by the MEMS substrate. The MEMS device further includes a first opening disposed in the MEMS substrate and a second opening disposed in the first polymer layer.
Public/Granted literature
Information query
IPC分类: