Invention Grant
- Patent Title: Thermosetting resin composition, prepreg, metal clad laminate plate, and printed wiring board
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Application No.: US14775691Application Date: 2014-10-23
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Publication No.: US09708468B2Publication Date: 2017-07-18
- Inventor: Yuki Kitai , Hiroaki Fujiwara , Hirosuke Saito
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2013-227673 20131031; JP2013-227674 20131031; JP2013-227675 20131031
- International Application: PCT/JP2014/005379 WO 20141023
- International Announcement: WO2015/064064 WO 20150507
- Main IPC: C08K5/521
- IPC: C08K5/521 ; C08J5/24 ; C08K3/34 ; C08L63/00 ; C08L101/00 ; C08K5/49 ; H05K1/03 ; B32B15/14 ; C08K3/36 ; C08K5/5399 ; C08G59/40
Abstract:
A thermosetting resin composition contains a thermosetting resin, a hardener capable of reacting with the thermosetting resin, and a flame retardant. The flame retardant contains a first phosphor compound compatible with a mixture of the thermosetting resin and the hardener, and a second phosphor compound incompatible with the mixture.
Public/Granted literature
- US20160060429A1 THERMOSETTING RESIN COMPOSITION, PREPREG, METAL CLAD LAMINATE PLATE, AND PRINTED WIRING BOARD Public/Granted day:2016-03-03
Information query
