Invention Grant
- Patent Title: Acoustic board having displaced and passably abutted multiple through holes
-
Application No.: US15058861Application Date: 2016-03-02
-
Publication No.: US09708811B2Publication Date: 2017-07-18
- Inventor: Jung-ya Hsieh , Yung-fu Lin , Yuan-Hsin Chang
- Applicant: Gixia Group Co.
- Applicant Address: TW Jhubei
- Assignee: Gixia Group Co.
- Current Assignee: Gixia Group Co.
- Current Assignee Address: TW Jhubei
- Agency: Wang Law Firm, Inc.
- Priority: CN201510101348 20150309
- Main IPC: E04B1/82
- IPC: E04B1/82 ; E04B1/84 ; G10K11/16 ; E04B1/74

Abstract:
An acoustic board having displaced and passably abutted multiple through-holes comprises an outer surface and an inner surface, in which the first through-holes formed from the outer surface toward the inner surface and the second through-holes formed from the inner surface toward the outer surface are displaced and passably abutted thereby conjunctively constituting acoustically absorptive micro-orifices. Herein at least some of the second through-holes have a cross-sectional area of greater than 1 mm2 and are displaced and passably abutted to at least some of the first through-holes, thereby collectively forming a plurality of acoustically absorptive micro-orifices having a cross-sectional area of smaller than 1 mm2, and, in comparison with the total area of the acoustic board, the opening rate for the sum of the cross-sectional areas of all such acoustically absorptive micro-orifices is less than 3%.
Public/Granted literature
- US20160265215A1 ACOUSTIC BOARD HAVING DISPLACED AND PASSABLY ABUTTED MULTIPLE THROUGH HOLES Public/Granted day:2016-09-15
Information query
IPC分类: