A hot gas path component including a substrate having an outer surface exposed to a stream of hot gases and an inner surface exposed to a cooling flow. One or more pair of cooling supply inlets is formed at the inner surface of the substrate for receiving the cooling air flow. One or more pair of cooling supply outlets is formed at the outer surface of the substrate for discharging the cooling air flow. A cooling flow channel extends through the substrate and between each of cooling supply inlets and the cooling supply outlets for permitting passage of the cooling air flow. Each pair of the one or more pair of cooling supply outlets is configured having complementary compound angles α and β, where α1 and α2 are injection angle components of the cooling flow discharged from each pair of the one or more pair of cooling supply outlets and β1 and β2 are compound transverse angle components of the cooling flow discharged from each pair of the one or more pair of cooling supply outlets, and wherein the transverse angle components β1 and β2 are of the same sign.