Invention Grant
- Patent Title: Chassis assembly structure
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Application No.: US15351983Application Date: 2016-11-15
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Publication No.: US09709207B1Publication Date: 2017-07-18
- Inventor: Chen-Fu Huang , An-Hsiu Lee , Tsai-Yi Lin
- Applicant: XYZPRINTING, INC. , KINPO ELECTRONICS, INC.
- Applicant Address: TW New Taipei TW New Taipei
- Assignee: XYZPRINTING, INC.,KINPO ELECTRONICS, INC.
- Current Assignee: XYZPRINTING, INC.,KINPO ELECTRONICS, INC.
- Current Assignee Address: TW New Taipei TW New Taipei
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Priority: CN201610863530 20160929
- Main IPC: A47B47/00
- IPC: A47B47/00 ; F16M1/08

Abstract:
A chassis assembly structure includes a surrounding plate assembly, first abutting elements, second abutting elements and a third board. The first and second boards are coupled to form the surrounding plate assembly. Each first abutting element has a slider and a first stop plate extended from the first (or second) board, and each second abutting element has first and second convex plates extended from the second (or first) board. Each first convex plate has a first positioning groove at an end and a second stop plate at the other end. Each second convex plate has a second positioning groove, and both ends of each slider are slidably coupled to and limited in each of the first and second positioning grooves, and each first stop plate is stopped and limited by each second stop plate, and the third board covers a side of the surrounding plate assembly.
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