Invention Grant
- Patent Title: Adhesive activation system for rounded surfaces
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Application No.: US14554721Application Date: 2014-11-26
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Publication No.: US09709226B2Publication Date: 2017-07-18
- Inventor: Mario Lopez Ruiz , Victor Najar Estrella
- Applicant: Flextronics AP, LLC
- Applicant Address: US CO Broomfield
- Assignee: Flextronics AP, LLC
- Current Assignee: Flextronics AP, LLC
- Current Assignee Address: US CO Broomfield
- Agency: Haverstock & Owens LLP
- Main IPC: F21K99/00
- IPC: F21K99/00 ; F21K9/90 ; B29C65/00 ; F21K9/23

Abstract:
An adhesive application system for rounded surfaces of a product. The adhesive activation system include a product body having a round outer perimeter, a band configured to fit along the outside of the round outer perimeter, a plurality of pressure pads arranged positioned along a curved pathway, a support configured to hold the product body such that the outer perimeter aligns with the curved pathway and one or more actuators coupled to each of the pressure pads and configured to move the pressure pads between a contracted position wherein curved inner sides of the pressure pads are substantially aligned with the curved pathway and thereby compress the band onto the round outer perimeter and an extended position wherein the curved inner sides are spaced away from the curved pathway.
Public/Granted literature
- US20160144609A1 ADHESIVE ACTIVATION SYSTEM FOR ROUNDED SURFACES Public/Granted day:2016-05-26
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