Invention Grant
- Patent Title: Method and system for heterogeneous substrate bonding for photonic integration
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Application No.: US14880936Application Date: 2015-10-12
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Publication No.: US09709735B2Publication Date: 2017-07-18
- Inventor: Stephen B. Krasulick , John Dallesasse
- Applicant: Skorpios Technologies, Inc.
- Applicant Address: US NM Albuquerque
- Assignee: Skorpios Technologies, Inc.
- Current Assignee: Skorpios Technologies, Inc.
- Current Assignee Address: US NM Albuquerque
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L25/00
- IPC: H01L25/00 ; G02B6/122 ; G02B6/12 ; G02B6/136 ; H01S5/022 ; H01L25/16 ; H01L33/00 ; H01L33/44 ; H01L33/48 ; H01L33/62 ; H01S5/02

Abstract:
A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.
Public/Granted literature
- US20160202415A1 METHOD AND SYSTEM FOR HETEROGENEOUS SUBSTRATE BONDING FOR PHOTONIC INTEGRATION Public/Granted day:2016-07-14
Information query
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