Invention Grant
- Patent Title: Hybrid computing module
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Application No.: US15161815Application Date: 2016-05-23
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Publication No.: US09710181B2Publication Date: 2017-07-18
- Inventor: L. Pierre de Rochemont , Alexander J. Kovacs
- Applicant: L. Pierre de Rochemont , Alexander J. Kovacs
- Agency: Burns & Levinson, LLP
- Agent David Gomes; Jerry Cohen
- Main IPC: G06F12/00
- IPC: G06F12/00 ; G06F3/06 ; G11C7/10 ; G06F9/30 ; G06F13/42 ; G06F1/28 ; G06F12/1009 ; G06F13/36 ; G06F9/38 ; G06F12/0875 ; G06F13/16 ; G06F13/24 ; G06F12/0862 ; G06F12/0815

Abstract:
A hybrid system-on-chip provides a plurality of memory and processor die mounted on a semiconductor carrier chip that contains a fully integrated power management system that switches DC power at speeds that match or approach processor core clock speeds, thereby allowing the transfer of data between off-chip physical memory and processor die.
Public/Granted literature
- US20170139624A1 HYBRID COMPUTING MODULE Public/Granted day:2017-05-18
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