Invention Grant
- Patent Title: Composite electronic component and board for mounting the same
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Application No.: US14258711Application Date: 2014-04-22
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Publication No.: US09711288B2Publication Date: 2017-07-18
- Inventor: Min Cheol Park , Sang Soo Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0130787 20131031
- Main IPC: H01G4/40
- IPC: H01G4/40 ; H01F27/28 ; H05K1/18 ; H01G2/06 ; H05K1/02 ; H05K3/34

Abstract:
A composite electronic component may include: a composite body including a combination of a capacitor formed of a ceramic body including a plurality of dielectric layers and first and second internal electrodes disposed to face one another with the dielectric layers interposed therebetween, and an inductor formed of a magnetic body including a coil unit; a first external electrode formed on the first lateral surface of the ceramic body and electrically connected to the first internal electrodes and a second external electrode formed on the second lateral surface of the ceramic body and electrically connected to the second internal electrodes; third and fourth external electrodes formed on first and second end surfaces of the magnetic body and connected to the coil unit, and first and second dummy electrodes formed on first and second end surfaces of the magnetic body.
Public/Granted literature
- US20150116891A1 COMPOSITE ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME Public/Granted day:2015-04-30
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