Invention Grant
- Patent Title: RF multi-feed structure to improve plasma uniformity
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Application No.: US15150968Application Date: 2016-05-10
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Publication No.: US09711330B2Publication Date: 2017-07-18
- Inventor: Kallol Bera
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: H01J7/24
- IPC: H01J7/24 ; H01J37/32
Abstract:
A plasma source assembly for use with a processing chamber is described. The assembly includes a multi-feed RF power connection to a single or multiple RF hot electrodes.
Public/Granted literature
- US20160254124A1 RF Multi-Feed Structure To Improve Plasma Uniformity Public/Granted day:2016-09-01
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