Invention Grant
- Patent Title: Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium
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Application No.: US14859924Application Date: 2015-09-21
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Publication No.: US09711348B2Publication Date: 2017-07-18
- Inventor: Atsushi Sano , Yoshiro Hirose
- Applicant: HITACHI KOKUSAI ELECTRIC INC.
- Applicant Address: JP Tokyo
- Assignee: HITACHI KOKUSAI ELECTRIC INC.
- Current Assignee: HITACHI KOKUSAI ELECTRIC INC.
- Current Assignee Address: JP Tokyo
- Agency: Volpe and Koenig, P.C.
- Priority: JP2014-194226 20140924
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C23C16/52 ; C23C16/455 ; H01L21/67 ; C23C16/30

Abstract:
The present invention increases controllability of a composition ratio of a multi-element film that contains a predetermined element and at least one element selected from the group consisting of boron, oxygen, carbon and nitrogen. There is provided a method of manufacturing a semiconductor device, including: forming a laminated film where a first film and a second film are laminated on a substrate by performing a cycle a predetermined number of times, the cycle including: (a) forming the first film being free of borazine ring structure and including a predetermined element and at least one element selected from the group consisting of oxygen, carbon and nitrogen; and (b) forming the second film having a borazine ring structure and including at least boron and nitrogen.
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Information query
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