Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US15048239Application Date: 2016-02-19
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Publication No.: US09711362B2Publication Date: 2017-07-18
- Inventor: Tatsuo Shimizu
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2015-061798 20150324
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L21/28 ; H01L29/66 ; H01L29/51 ; H01L29/40 ; H01L29/423 ; H01L29/06 ; H01L29/20 ; H01L29/24

Abstract:
A semiconductor device of an embodiment includes a first layer, a second layer provided on the first layer, the second layer forming a two-dimensional electron gas in the first layer, a source electrode provided on the second layer, a drain electrode provided on the second layer, a gate electrode provided between the source electrode and the drain electrode on the second layer, and a first insulating layer provided between the gate electrode and the drain electrode on the second layer, the first insulating layer being a first oxide of at least one first element selected from the group consisting of Hf, Zr, Ti, Al, La, Y, and Sc, the first insulating layer containing 5×1019 cm−3 or more of at least one second element selected from the group consisting of F, H, D, V, Nb, and Ta.
Public/Granted literature
- US20160284830A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-09-29
Information query
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