A method electrically connects by crimping electrical conductors in a connector for equipotential connection of a planar and flexible layer formed by the conductors, to metal components. The method includes positioning the electrical conductors in individual longitudinal and parallel cells which are formed between two planar walls of the connector, crimping the conductors crimped in a crimping zone by simultaneous transverse punching of at least one wall of the connector, and forming by the transverse punching at least one corresponding transverse groove line on the at least one connector wall and, by load transfer, on each of the conductors to electrically connect the conductors.