Invention Grant
- Patent Title: Chip on film flexible circuit board and display device
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Application No.: US14235955Application Date: 2013-12-12
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Publication No.: US09713249B2Publication Date: 2017-07-18
- Inventor: Liang Cheng , Yang Li , Peng Qi , Yang Huang , Xiaowei Gong , Lian Sun , Chunyang Nie , Min Wang
- Applicant: HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Hefei
- Assignee: HEFEI Optoelectronics Technology Co., Ltd.
- Current Assignee: HEFEI Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Hefei
- Agency: Banner & Witcoff, Ltd.
- Priority: CN201310153971 20130427
- International Application: PCT/CN2013/089305 WO 20131212
- International Announcement: WO2014/173144 WO 20141030
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/11 ; H05K3/32

Abstract:
A Chip on Film (COF) flexible circuit board and a display device using the COF flexible circuit board are provided. The circuit board includes: a substrate; a plurality of conductive terminals arranged separately in parallel over the substrate, each of the plurality of conductive terminals including a wide line and a narrow line; and a anisotropic conductive adhesive region provided over the substrate. A connection site of the wide line and the narrow line is located in an overlapping area of the anisotropic conductive adhesive region and the substrate. The embodiments of the invention can reduce the probability of the circuit board being broken and the undesirable phenomena such as open circuit.
Public/Granted literature
- US20150173170A1 CHIP ON FILM FLEXIBLE CIRCUIT BOARD AND DISPLAY DEVICE Public/Granted day:2015-06-18
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