Invention Grant
- Patent Title: Systems and methods for simulations of reliability in printed circuit boards
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Application No.: US14875799Application Date: 2015-10-06
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Publication No.: US09715571B1Publication Date: 2017-07-25
- Inventor: Rajiv Lochan Rath , Vamsi Krishna Yaddanapudi , Ankit Adhiya
- Applicant: SAS IP, Inc.
- Applicant Address: US PA Canonsburg
- Assignee: Ansys, Inc.
- Current Assignee: Ansys, Inc.
- Current Assignee Address: US PA Canonsburg
- Agency: Jones Day
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Systems and methods are provided for simulations of printed circuit boards (PCBs). Geometry data related to a PCB is determined from layout data associated with the PCB. A finite element mesh is generated based at least in part on the geometry data related to the PCB, the finite element mesh including one or more mesh components. One or more conductors passing through the one or more mesh components are identified. A volume fraction of the one or more conductors within the one or more mesh components is computed. One or more physical properties of the one or more mesh components are adjusted based at least in part on the volume fraction.
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