Invention Grant
- Patent Title: Hierarchical wire-pin co-optimization
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Application No.: US14879186Application Date: 2015-10-09
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Publication No.: US09715572B2Publication Date: 2017-07-25
- Inventor: Christopher J. Berry , Ajith Kumar M. Chandrasekaran , Randall J. Darden , Shyam Ramji , Sourav Saha
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Margaret A. McNamara
- Main IPC: G06F17/00
- IPC: G06F17/00 ; G06F17/50

Abstract:
A method and system to perform physical synthesis in a chip design process using hierarchical wire-pin co-optimization are described. The method includes providing boundary conditions to each of a plurality of macros of the chip design from a unit level controller, the boundary conditions including initial pin locations and an indication of which of the pins are movable pins for each of the plurality of macros, performing macro-level physical synthesis at each of the plurality of macros, and providing feedback to the unit level controller based on the macro-level physical synthesis performed at each of the plurality of macros, the feedback including a proposed new location for the movable pins of each of the plurality of blocks. The method also includes performing hierarchical co-optimization at the unit level controller based on the feedback from each of the plurality of macros to determine locations for the movable pins.
Public/Granted literature
- US20170011163A1 HIERARCHICAL WIRE-PIN CO-OPTIMIZATION Public/Granted day:2017-01-12
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