Invention Grant
- Patent Title: Method of manufacturing baseplate for an electronic module
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Application No.: US15070942Application Date: 2016-03-15
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Publication No.: US09716018B2Publication Date: 2017-07-25
- Inventor: Fabio Brucchi , Davide Chiola
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/48 ; H01L23/498 ; H01L23/13 ; H01L23/36 ; H01L23/373 ; H01L25/11 ; H01L21/56
Abstract:
Various embodiments provide methods for manufacturing a baseplate for an electronic module and an electronic module comprising a baseplate, wherein the baseplate comprises a conductive material; and a recess formed in one main surface of the baseplate and being adapted to accommodate an electronic chip.
Public/Granted literature
- US20160196989A1 Baseplate for an electronic module and method of manufacturing the same Public/Granted day:2016-07-07
Information query
IPC分类:
