- Patent Title: Wafer processing method using adhesive tape to pick up device chips
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Application No.: US15234587Application Date: 2016-08-11
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Publication No.: US09716040B2Publication Date: 2017-07-25
- Inventor: Takashi Haimoto , Hideki Koshimizu , Yurika Araya , Tetsukazu Sugiya
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Disco Corporation
- Current Assignee: Disco Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain Ltd.
- Priority: JP2015-163365 20150821
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/306 ; H01L21/304 ; H01L21/683
Abstract:
A wafer processing method of processing a wafer with a plurality of devices disposed in areas demarcated by projected division lines and formed on a face side thereof includes a protective member placing step of placing a protective member for protecting the face side of the wafer on the face side of the wafer which is divided into individual device chips, a resin laying step of laying a die-bonding resin on the reverse sides of the individual device chips by applying a die-bonding liquid resin on the reverse side of the wafer and hardening the applied die-bonding liquid resin, and a separation step of separating the device chips with the die-bonding liquid resin laid on the reverse sides thereof from the wafer.
Public/Granted literature
- US20170053830A1 WAFER PROCESSING METHOD Public/Granted day:2017-02-23
Information query
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