Invention Grant
- Patent Title: Method of measuring a substrate and method of manufacturing a semiconductor device using the same
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Application No.: US15218026Application Date: 2016-07-24
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Publication No.: US09716047B2Publication Date: 2017-07-25
- Inventor: Chol-Min Jhon , Seok Park , Ho-Hyung Jung , Yang-Kyu Kim , Jae-Young Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G01B11/00 ; G01B11/06 ; H01L21/78 ; H01L21/52
Abstract:
A method for measuring a substrate is provided. The method comprises irradiating a measurement beam into a site box of an identifiable pattern of a substrate, detecting a center position of the irradiated measurement beam, calculating an amount of shift of the center position of the measurement beam from the center position of the site box, and correcting the center position of the measurement beam to the center position of the site box by compensating the calculated amount of shift.
Public/Granted literature
- US20170103925A1 METHOD OF MEASURING A SUBSTRATE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME Public/Granted day:2017-04-13
Information query
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