A method for providing an inductively loaded integrated circuit includes providing a wafer with an integrated circuit formed thereon, the integrated circuit comprising at least one substrate via, including one or more substrate vias that are to be inductively loaded, and fabricating an inductive element on the backside of the wafer that electrically connects to the substrate vias that are to be inductively loaded. A corresponding apparatus includes a wafer with an integrated circuit formed on a top side of the wafer and an inductive element formed on a back side of the wafer, and at least one substrate via that extends through the wafer and electrically connects the inductive element to the integrated circuit. In certain embodiments, the inductive element comprises a plurality of conductive layers. In some embodiments, the inductive element comprises multiple turns on each conductive layer.