Invention Grant
- Patent Title: Assembly process of two substrates
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Application No.: US14947254Application Date: 2015-11-20
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Publication No.: US09718261B2Publication Date: 2017-08-01
- Inventor: Didier Landru , Capucine Delage , Franck Fournel , Elodie Beche
- Applicant: Soitec , Commissariat A L'Energie Atomique et aux Energies Alternatives
- Applicant Address: FR Bernin FR Paris
- Assignee: SOITEC,Commissariat A L'Energie Atomique et aux Energies Alternatives
- Current Assignee: SOITEC,Commissariat A L'Energie Atomique et aux Energies Alternatives
- Current Assignee Address: FR Bernin FR Paris
- Agency: TraskBritt
- Priority: FR1461544 20141127
- Main IPC: H01L21/30
- IPC: H01L21/30 ; B32B37/00 ; H01L21/20 ; B32B38/00 ; H01L21/324 ; H01L21/762
Abstract:
A method for assembling two substrates by molecular adhesion comprises: a first step (a) of putting first and second substrates in close contact in order to form an assembly having an assembly interface; a second step (b) of reinforcing the degree of adhesion of the assembly beyond a threshold adhesion value at which water is no longer able to diffuse along the assembly interface. The method also comprises a step (c) of anhydrous treatment of the first and second substrates in a treatment atmosphere having a dew point below −10° C., and control of the dew point of a working atmosphere to which the first and second substrates are exposed from the anhydrous treatment step (c) until the end of the second step (b) so as to limit or prevent the appearance of bonding defects at the assembly interface.
Public/Granted literature
- US20160152017A1 ASSEMBLY PROCESS OF TWO SUBSTRATES Public/Granted day:2016-06-02
Information query
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