A thermal management system and methods for use are disclosed. The thermal management system comprises a shield portion and a dissipation portion. The shield portion may comprise a hot side skin, a conduction layer, an insulation layer, and a cool side skin. The dissipation portion may comprise a fin array. Heat absorbed by the shield portion is partially or fully conducted to the dissipation portion for transfer to the ambient environment. The thermal management system may be employed as an aircraft wheel heat shield, an automotive brake heat shield, a gas turbine heat shield, an electronic heat sink, and in various other applications where heat shielding and/or heat transfer are desirable.