According to various embodiments, a package arrangement may include: a first encapsulation material; at least one electronic circuit at least partially embedded in the first encapsulation material, the at least one electronic circuit including a first contact pad structure at a first side of the at least one electronic circuit; at least one electromechanical device disposed over the first side of the at least one electronic circuit, the at least one electromechanical device including a second contact pad structure facing the first side of the at least one electronic circuit; a redistribution layer structure between the at least one electromechanical device and the at least one electronic circuit, the redistribution layer structure electrically connecting the first contact pad structure with the second contact pad structure, wherein a gap is provided between the at least one electromechanical device and the redistribution layer structure; a second encapsulation material at least partially covering the at least one electromechanical device, wherein the gap is free of the second encapsulation material.