Article and active energy ray-curable resin composition
Abstract:
Provided is an article having high scratch resistance and satisfactory fingerprint wipeability. Disclosed is an article having a microrelief structure containing a cured product of a resin composition on the surface, in which the indentation elastic modulus (X) [MPa] and the creep deformation ratio (Y) [%] of the cured product satisfy the following formulas (1) and (2): 80≦X≦560  (1) Y≦(0.00022X−0.01)×100  (2).
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