Invention Grant
- Patent Title: Polymer thick film silver conductor with inverted cure profile behavior
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Application No.: US14736791Application Date: 2015-06-11
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Publication No.: US09718966B2Publication Date: 2017-08-01
- Inventor: Jay Robert Dorfman
- Applicant: E I DU PONT DE NEMOURS AND COMPANY
- Applicant Address: US DE Wilmington
- Assignee: E I DU PONT DE NEMOURS AND COMPANY
- Current Assignee: E I DU PONT DE NEMOURS AND COMPANY
- Current Assignee Address: US DE Wilmington
- Main IPC: H01B1/22
- IPC: H01B1/22 ; C09D5/24 ; H05K1/09 ; C08K3/08 ; C09D127/16 ; C09D11/52
Abstract:
This invention is directed to a polymer thick film conductor composition that provides a better conductor when dried at 80° C. than when dried at 130° C., in contrast to typical PTF conductors. More specifically, the polymer thick film conductor may be used in applications where low temperature curing is required.
Public/Granted literature
- US20160017156A1 POLYMER THICK FILM SILVER CONDUCTOR WITH INVERTED CURE PROFILE BEHAVIOR Public/Granted day:2016-01-21
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