Invention Grant
- Patent Title: Hot melt adhesive and method of forming the same
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Application No.: US14771987Application Date: 2014-03-04
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Publication No.: US09719000B2Publication Date: 2017-08-01
- Inventor: Rajesh Kumar , Nikolay Lebedinski , Lyle Andrew Caillouette
- Applicant: BASF SE
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- Agency: Howard & Howard Attorneys PLLC
- International Application: PCT/US2014/020294 WO 20140304
- International Announcement: WO2014/158809 WO 20141002
- Main IPC: C09J175/06
- IPC: C09J175/06 ; B32B21/00 ; B32B15/00 ; B32B7/12 ; C08G18/62 ; C08G18/76 ; C08G18/40 ; C09J175/16

Abstract:
A hot melt adhesive (HMA), which is solid at room temperature, comprises the reaction product of 5 to 25% by weight of an isocyanate component having an NCO content of from about 20 to about 50% by weight, 75 to 85% by weight of a polyester, and 1 to 10% by weight of a hydroxy-polymer having an OH number of from about 40 to about 50. A method of forming the adhesive comprises the step of combining the isocyanate component, polyester, and hydroxy-polymer to form the adhesive. The adhesive can be used for various purposes, such as for forming an adhesive layer which adhesively couples surfaces together.
Public/Granted literature
- US20160009969A1 Holt Melt Adhesive And Method Of Forming The Same Public/Granted day:2016-01-14
Information query
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