A ceramic card having a thick film network, with conductive vias formed as part of the card. Each of the vias is in electrical communication with both sides of the thick film network, allowing the pads and the pad senders to be formed on both sides of the card. This configuration maintains the contact when one of the connectors is subjected to bending force or is otherwise displaced, maintaining contact with at least one of the pads, and allowing the system to still function. The double sided thick film network allows for each connector to touch both sides of one of the pads, and still maintain electrical communication with the level sender, thus eliminating the failure mode of intermittent contact with the thick film network resulting from movement of the connector.