Invention Grant
- Patent Title: Optical waveguide, optical interconnection component, optical module, opto-electric hybrid board, and electronic device
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Application No.: US14408448Application Date: 2013-06-18
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Publication No.: US09720171B2Publication Date: 2017-08-01
- Inventor: Shinya Arai
- Applicant: SUMITOMO BAKELITE CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO BAKELITE CO., LTD.
- Current Assignee: SUMITOMO BAKELITE CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-138118 20120619; JP2012-138119 20120619; JP2012-138120 20120619; JP2013-125972 20130614; JP2013-125973 20130614
- International Application: PCT/JP2013/066729 WO 20130618
- International Announcement: WO2013/191175 WO 20131227
- Main IPC: G02B6/122
- IPC: G02B6/122 ; G02B6/42 ; G02B6/43 ; G02B6/125

Abstract:
In accordance with the present invention, an opto-electric hybrid board in which optical wiring is freely disposed without restriction by the arrangement of electrical elements and the like, and in which high-density mounting of electrical wiring and optical wiring is possible, and an electric device including this opto-electric hybrid board are provided. An opto-electrical hybrid board (1000) of the present invention has an optical waveguide (1), an optical connector disposed at an end section of the optical waveguide (1), and an opto-electric conversion section (4) disposed below the optical waveguide (1), and a motherboard (electrical wiring board) (5) disposed below the opto-electric conversion portion (4). Of these, the optical waveguide (1) includes a core layer (13) including a plurality of core sections (14) being configured to intersect with each other at one plane and side surface cladding sections, and a mirror (optical path conversion section) 17 converting the optical path of the core sections (14). Also, between the optical waveguide (1) and the motherboard (5) is connected via an electrical connector and preferably both the optical waveguide (1) and the motherboard (5) are detachable.
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