Invention Grant
- Patent Title: Interface for transmitting high-speed signal and optical module including the same
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Application No.: US14619539Application Date: 2015-02-11
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Publication No.: US09720192B2Publication Date: 2017-08-01
- Inventor: Jyung Chan Lee , Eun Gu Lee , Sil Gu Mun , Sang Soo Lee
- Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Applicant Address: KR Daejeon-si
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon-si
- Agency: Ladas & Parry LLP
- Priority: KR10-2014-0016185 20140212
- Main IPC: H04B10/00
- IPC: H04B10/00 ; G02B6/42

Abstract:
An interface for transmitting a high-speed signal and an optical module including the same. The interface may include a main substrate and a sub-substrate. The main substrate may have at least one high-speed signal line formed on the upper surface of the main substrate. The sub-substrate may have a first conductive line formed on the lower surface thereof so as to adjust high-speed signal transmission characteristics of the high-speed signal line, wherein the first conductive line may be coupled to the upper surface of the main substrate and partially overlap with the high-speed signal line.
Public/Granted literature
- US20150229402A1 INTERFACE FOR TRANSMITTING HIGH-SPEED SIGNAL AND OPTICAL MODULE INCLUDING THE SAME Public/Granted day:2015-08-13
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