Invention Grant
- Patent Title: Band type electronic device and substrate arrangement method
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Application No.: US14817960Application Date: 2015-08-04
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Publication No.: US09720376B2Publication Date: 2017-08-01
- Inventor: Teppei Tsushima
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Sony Corporation,Sony Mobile Communications Inc.
- Current Assignee: Sony Corporation,Sony Mobile Communications Inc.
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: G04G17/06
- IPC: G04G17/06 ; G04B37/14 ; G04R60/04 ; A44C5/00 ; A44C5/02
Abstract:
A band-type electronic device and a method for configuration of a flexible circuit board in a band-type electronic device are disclosed. The band-type electronic device includes a plurality of segments connected with each other in a band-like shape, a plurality of electronic components arranged in the plurality of segments, and a flexible circuit board connected to the plurality of electronic components arranged in the plurality of segments, wherein the flexible circuit board is partly deformed into a meandering shape in at least one of the plurality of segments.
Public/Granted literature
- US20160139564A1 BAND TYPE ELECTRONIC DEVICE AND SUBSTRATE ARRANGEMENT METHOD Public/Granted day:2016-05-19
Information query
