Invention Grant
- Patent Title: Thermal mitigation adaptation for a mobile electronic device
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Application No.: US13963248Application Date: 2013-08-09
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Publication No.: US09720467B2Publication Date: 2017-08-01
- Inventor: Ankur Jain , Unnikrishnan Vadakkanmaruveedu , Vinay Mitter
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: The Marbury Law Group, PLLC
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H04M1/725

Abstract:
The various embodiments provide methods and systems for adjusting the thermal mitigation system of a mobile electronic device when an add-on outer casing is attached. The mobile electronic device determine whether an add-on outer case is attached to the mobile electronic device and change a thermal mitigation parameter of a thermal mitigation process implemented on the mobile electronic device in response. The determination may be via a sensor or a user input. A changed thermal mitigation parameter may be stored in memory, or input by a user or in a communication from the add-on case. The changed thermal mitigation parameter may be determined based on a particular make, model or properties of the add-on case, and/or may be obtained from a database stored in the device or accessed via a network. Removal of the case may be detected and the thermal mitigation parameter returned to an initial value.
Public/Granted literature
- US20150043156A1 Thermal Mitigation Adaptation for a Mobile electronic device Public/Granted day:2015-02-12
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