Invention Grant
- Patent Title: Method for manufacturing silica layer, silica layer, and electronic device
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Application No.: US15178378Application Date: 2016-06-09
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Publication No.: US09721785B2Publication Date: 2017-08-01
- Inventor: Jiho Lee , Kunbae Noh , Huichan Yun , Jin-Hee Bae , Wanhee Lim
- Applicant: SAMSUNG SDI CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: Samsung SDI Co., Ltd.
- Current Assignee: Samsung SDI Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Lewis Roca Rothgerber Christie LLP
- Priority: KR10-2015-0137077 20150925
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/02
Abstract:
A method of manufacturing a silica layer includes: coating a pre-wetting liquid material including a carbon compound on a substrate; coating a composition for forming a silica layer on the substrate coated with the pre-wetting liquid material; and curing a substrate coated with the composition for forming a silica layer.
Public/Granted literature
- US20170092488A1 METHOD FOR MANUFACTURING SILICA LAYER, SILICA LAYER, AND ELECTRONIC DEVICE Public/Granted day:2017-03-30
Information query
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