Invention Grant
- Patent Title: Method for mounting semiconductors provided with bumps on substrate locations of a substrate
-
Application No.: US15250796Application Date: 2016-08-29
-
Publication No.: US09721819B2Publication Date: 2017-08-01
- Inventor: Florian Speer
- Applicant: Besi Switzerland AG
- Applicant Address: CH Cham
- Assignee: BESI SWITZERLAND AG
- Current Assignee: BESI SWITZERLAND AG
- Current Assignee Address: CH Cham
- Agency: CanaanLaw, P.C.
- Agent David B. Ritchie
- Priority: CH1248/15 20150831; CH1404/15 20150928
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/67 ; H01L21/56 ; H01L23/00
Abstract:
The invention relates to a method for mounting semiconductor chips provided with bumps as flip chips on substrate locations of a substrate. The method comprises the placing of a flip chip in a cavity arranged in a stationary manner where the bumps are wetted with a fluxing agent and the position of the flip chip is determined by means of a camera. The method further comprises the use of a transport head and a bonding head, which allow rapid and highly precise mounting.
Public/Granted literature
- US20170062257A1 Method For Mounting Semiconductors Provided With Bumps On Substrate Locations Of A Substrate Public/Granted day:2017-03-02
Information query
IPC分类:
